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Communication Dans Un Congrès Année : 2019

Modeling of void closure mechanisms in multi-stages hot metal forming processes: a multiscale approach

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Matériaux
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hal-02114042 , version 1 (29-04-2019)

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  • HAL Id : hal-02114042 , version 1

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Pierre-Olivier Bouchard, Abdelouahed Chbihi, Marc Bernacki, Daniel Pino Muñoz. Modeling of void closure mechanisms in multi-stages hot metal forming processes: a multiscale approach. NUMIFORM 2019: the 13th International Conference on Numerical Methods in Industrial Forming Processes, Jun 2019, Portsmouth, United States. ⟨hal-02114042⟩
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